Flex SLC modules can be cooled via air or water
OCZ is on a roll at the moment. Barely a couple of weeks after it announced 1.8GHz DDR3 modules, it’s now launched a 2GB pack of PC3-12800 DDR3 modules using its unique water cooled Flex SLC heatsink.
In typical overclockers’ kiddy jargon, XLC stands for Xtreme Liquid Convention, and it allows you to connect your RAM to a water-cooling loop via an ‘integrated liquid injection’ system. The idea is that you’ll then be able to shift even more heat away from the modules, which OCZ claims will allow ‘the memory to operate at extreme speeds without the high temperatures that inhibit or damage the modules.’
OCZ’s vice president of technology, Dr Michael Schuette, explained the move, saying that ‘increasing clock frequency translates into a linear increase in power consumption and heat dissipation, and with DDR3 hitting doubling the frequency of DDR2, the memory technology is facing serious thermal challenges that require advanced solutions of heat management.’
The 2GB dual-channel kit will comprise two 1GB modules, which are rated to run at 1.6GHz with latency timings of 6-6-6-18. They will also come with a lifetime warranty.
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i think it will be using the tape form of the Tim.... but this in itself will likely be just as effective as some manually applied methods... if not better (as it gurantees a smoother finish as well as keeping it as minimum as possible) whilst also driving down a bit of cost (in batch production)
I hope they use some sort of top quality TIM between the chips and the heat spreaders (sg AS5 or MX1). There's no point having water cooling if you use cheap and nasty TIM.
Guessing the kit still relies on glued on heatspreaders though ;) Good idea poorly excecuted.
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